The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 11, 2015

Filed:

Sep. 05, 2008
Applicants:

Moses M. David, Woodbury, MN (US);

Guoping Mao, Woodbury, MN (US);

Olester Benson, Jr., Woodbury, MN (US);

Robert J. Devoe, Arden Hills, MN (US);

Jennifer J. Sahlin, Minneapolis, MN (US);

Inventors:

Moses M. David, Woodbury, MN (US);

Guoping Mao, Woodbury, MN (US);

Olester Benson, Jr., Woodbury, MN (US);

Robert J. DeVoe, Arden Hills, MN (US);

Jennifer J. Sahlin, Minneapolis, MN (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 59/16 (2006.01); B29C 33/58 (2006.01); C23C 16/40 (2006.01); G02B 1/118 (2015.01); B29C 33/38 (2006.01); B29C 33/40 (2006.01); B29K 83/00 (2006.01); B29K 105/00 (2006.01);
U.S. Cl.
CPC ...
B29C 33/58 (2013.01); C23C 16/401 (2013.01); G02B 1/118 (2013.01); B29C 33/3857 (2013.01); B29C 33/405 (2013.01); B29K 2083/005 (2013.01); B29K 2105/0082 (2013.01);
Abstract

A method of forming a working mold including: placing a substrate () on an electrode in a chamber, the substrate having at least a first structured surface () and the substrate including a thermoset polymeric material; introducing a release () layer forming gas into the chamber, wherein the release layer forming gas includes silicon containing gas and oxygen gas in an atomic ratio of not greater than about 200; providing power to the electrode to create a plasma of the release layer forming gas within the chamber; and depositing a release layer formed from the release layer forming gas on at least the first structured surface of the substrate to form a working mold.


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