The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 11, 2015

Filed:

May. 25, 2006
Applicants:

Anna Lee Tonkovich, Dublin, OH (US);

Kai Tod Paul Jarosch, Bexley, OH (US);

Jeffrey D. Marco, South Charleston, OH (US);

Bin Yang, Columbus, OH (US);

Sean Patrick Fitzgerald, Columbus, OH (US);

Steven T. Perry, Galloway, OH (US);

Thomas Yuschak, Lewis Center, OH (US);

Francis P. Daly, Delaware, OH (US);

Haibiao Chen, Powell, OH (US);

Inventors:

Anna Lee Tonkovich, Dublin, OH (US);

Kai Tod Paul Jarosch, Bexley, OH (US);

Jeffrey D. Marco, South Charleston, OH (US);

Bin Yang, Columbus, OH (US);

Sean Patrick Fitzgerald, Columbus, OH (US);

Steven T. Perry, Galloway, OH (US);

Thomas Yuschak, Lewis Center, OH (US);

Francis P. Daly, Delaware, OH (US);

Haibiao Chen, Powell, OH (US);

Assignee:

Velocys, Inc., Plain City, OH (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C07C 2/58 (2006.01); B01F 5/06 (2006.01); B01F 5/04 (2006.01); B01F 13/00 (2006.01); B01J 19/00 (2006.01); F28F 3/04 (2006.01); F28F 13/00 (2006.01);
U.S. Cl.
CPC ...
B01F 5/0646 (2013.01); B01F 5/0475 (2013.01); B01F 5/061 (2013.01); B01F 5/0655 (2013.01); B01F 13/0059 (2013.01); B01J 19/0093 (2013.01); B01J 2219/0086 (2013.01); B01J 2219/00783 (2013.01); B01J 2219/00835 (2013.01); B01J 2219/00844 (2013.01); B01J 2219/00867 (2013.01); B01J 2219/00873 (2013.01); B01J 2219/00889 (2013.01); B01J 2219/00905 (2013.01); B01J 2219/00918 (2013.01); F28F 3/048 (2013.01); F28F 13/003 (2013.01); F28F 2260/02 (2013.01);
Abstract

The disclosed technology relates to an apparatus, comprising: at least one microchannel, the microchannel comprising at least one heat transfer wall; a porous thermally conductive support in the microchannel in contact with the heat transfer wall; a catalyst or a sorption medium supported by the porous support; and a heat source and/or heat sink in thermal contact with the heat transfer wall.


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