The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 11, 2015

Filed:

Mar. 05, 2014
Applicant:

Medtronic, Inc., Minneapolis, MN (US);

Inventor:

Jonathan A Hughes, Blaine, MN (US);

Assignee:

Medtronic, Inc., Minneapolis, MN (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 24/04 (2006.01); A61N 1/375 (2006.01); H01R 13/516 (2006.01); H01R 43/16 (2006.01);
U.S. Cl.
CPC ...
A61N 1/3752 (2013.01); H01R 13/516 (2013.01); H01R 43/16 (2013.01);
Abstract

An implantable lead connector assembly includes contact rings, and a bulk of insulation, which includes sealing surfaces and a shank defining a distal end of the bulk. One or more conductor pins extend within the bulk and have distal ends protruding distally therefrom to be exposed alongside the shank; and an inner surface of each contact ring may have a proximal end of a corresponding conductor pin coupled thereto. The sealing surfaces, in conjunction with outer contact surfaces of the contact rings, which are interspersed therebetween, define a uniform outer diameter for the connector assembly. The bulk of insulation may be formed in two parts, wherein a primary bulk is formed around a core and includes circuit-support and shank segments. A secondary bulk, which includes the aforementioned sealing surfaces, is injection molded around the primary bulk, after positioning the contact rings and corresponding conductor pins on the circuit-support segment thereof.


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