The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 11, 2015

Filed:

Oct. 14, 2010
Applicants:

Stephanie M. Deruntz, Warsaw, IN (US);

Daren L. Deffenbaugh, Winona Lake, IN (US);

Hengda D. Liu, Warsaw, IN (US);

Andrew J. Martin, Ann Arbor, MI (US);

Jeffrey A. Rybolt, Fort Wayne, IN (US);

Bryan J. Smith, Fort Wayne, IN (US);

Anthony D. Zannis, Fort Wayne, IN (US);

Inventors:

Stephanie M. Deruntz, Warsaw, IN (US);

Daren L. Deffenbaugh, Winona Lake, IN (US);

Hengda D. Liu, Warsaw, IN (US);

Andrew J. Martin, Ann Arbor, MI (US);

Jeffrey A. Rybolt, Fort Wayne, IN (US);

Bryan J. Smith, Fort Wayne, IN (US);

Anthony D. Zannis, Fort Wayne, IN (US);

Assignee:

DEPUY (IRELAND), Cork, IE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
A61F 2/28 (2006.01); A61F 2/38 (2006.01); A61F 2/30 (2006.01); A61L 27/04 (2006.01); A61L 27/06 (2006.01); A61L 27/50 (2006.01); A61L 27/56 (2006.01); B22F 3/11 (2006.01); B22F 7/00 (2006.01); C22C 14/00 (2006.01); C22C 19/07 (2006.01); C22C 27/02 (2006.01); A61F 2/42 (2006.01);
U.S. Cl.
CPC ...
A61F 2/30734 (2013.01); A61F 2/38 (2013.01); A61L 27/04 (2013.01); A61L 27/06 (2013.01); A61L 27/50 (2013.01); A61L 27/56 (2013.01); B22F 3/1121 (2013.01); B22F 3/1146 (2013.01); B22F 7/006 (2013.01); C22C 14/00 (2013.01); C22C 19/07 (2013.01); C22C 27/02 (2013.01); A61F 2/4202 (2013.01); A61F 2002/3092 (2013.01); A61F 2002/30604 (2013.01); A61F 2002/30878 (2013.01); A61F 2002/30968 (2013.01); A61F 2310/00023 (2013.01); A61L 2400/18 (2013.01);
Abstract

A joint prosthesis system is suitable for cementless fixation. The system has two metal implant components and a bearing. One of the metal implant components has an articulation surface for articulation with the bearing. The other metal implant component has a mounting surface for supporting the bearing. One of the metal implant components includes a solid metal portion and a porous metal portion. The porous metal portion has surfaces with different characteristics, such as roughness, to improve bone fixation, ease removal of the implant component in a revision surgery, reduce soft tissue irritation, improve the strength of a sintered bond between the solid and porous metal portions, or reduce or eliminate the possibility of blood traveling through the porous metal portion into the joint space. A method of making the joint prosthesis is also disclosed. The invention may also be applied to discrete porous metal implant components, such as augment.


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