The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 04, 2015

Filed:

Dec. 31, 2012
Applicants:

Peking University Founder Group Co., Ltd., Beijing, CN;

Zhuhai Founder Tech. Multilayer Pcb Co., Ltd., Zhuhai, Guangdong, CN;

Zhuhai Founder Pcb Development Co., Ltd., Zhuhai, Guangdong, CN;

Inventor:

Yansheng Hua, Beijing, CN;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 3/46 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 3/46 (2013.01); H05K 1/0201 (2013.01); H05K 1/0204 (2013.01); H05K 3/4694 (2013.01); H05K 3/4611 (2013.01); H05K 2201/10416 (2013.01); Y10T 156/1056 (2015.01);
Abstract

A method of fabricating a printed circuit board is disclosed. The method includes opening a first window in a first base board and opening a second window in a second base board and a resin layer. The resin layer is between the second base board and the first base board. The method further includes bonding the first base board and the second base board through the resin layer; placing a heat dissipating conductor in the first window in the first base board through the second window; placing a resin portion on the first base board in the second window; embedding a sub-board in the second window of the second base board; and bonding the sub-board with the first base board through the resin portion.


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