The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 04, 2015

Filed:

May. 22, 2012
Applicants:

Bo-shiung Huang, New Taipei, TW;

Han-ching Shih, Guishan Township, Taoyuan County, TW;

Tzu-yuan Fan, Zhongli, TW;

Wei-hsiung Yang, Zhunan Township, Miaoli County, TW;

Kai-hsiang Chen, New Taipei, TW;

Inventors:

Bo-Shiung Huang, New Taipei, TW;

Han-Ching Shih, Guishan Township, Taoyuan County, TW;

Tzu-Yuan Fan, Zhongli, TW;

Wei-Hsiung Yang, Zhunan Township, Miaoli County, TW;

Kai-Hsiang Chen, New Taipei, TW;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23P 11/00 (2006.01); H05K 1/16 (2006.01); H01F 41/02 (2006.01); H01F 41/14 (2006.01);
U.S. Cl.
CPC ...
H05K 1/165 (2013.01); H01F 41/0253 (2013.01); H01F 41/14 (2013.01); H05K 2201/086 (2013.01); H05K 2201/09854 (2013.01); Y10T 29/4902 (2015.01); Y10T 29/49075 (2015.01); Y10T 29/49826 (2015.01); Y10T 29/49833 (2015.01);
Abstract

A method of embedding a magnetic component in a substrate is disclosed. Holes are formed in a substrate by mechanically drilling. Each of the holes includes a top opening, a bottom and sidewall, wherein an area of the top opening is larger than that of the bottom. The sidewall extends from the top opening vertically downwards to a predetermined depth, and then is slanted inwardly to the bottom to form a sloped sidewall at the bottom of the hole. A predetermined region is defined along a portion of an edge of the top opening, and a portion of the substrate material under the predetermined region is removed by routing to form a component accommodation trench with a portion of the sloped sidewall at the bottom. Then, a magnetic component is placed into the component accommodation trench.


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