The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 04, 2015
Filed:
Jul. 13, 2012
Won Hee Yoo, Gyeonggi-do, KR;
Byeung Gyu Chang, Gyeonggi-do, KR;
Taek Jung Lee, Gyeonggi-do, KR;
Yun Hwi Park, Gyeonggi-do, KR;
Won Hee Yoo, Gyeonggi-do, KR;
Byeung Gyu Chang, Gyeonggi-do, KR;
Taek Jung Lee, Gyeonggi-do, KR;
Yun Hwi Park, Gyeonggi-do, KR;
SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon, KR;
Abstract
Disclosed herein are a thin film electrode ceramic substrate and a method for manufacturing the same. The thin film electrode ceramic substrate includes: a ceramic substrate; one or more anti-etching metal layers formed in a surface of the ceramic substrate; thin film electrode pattern formed on the anti-etching metal layers; and a plating layer formed on the thin film electrode pattern, wherein respective edge portions of the thin film electrode pattern are contacted with the anti-etching metal layer, and thus, an undercut defect occurring between the surface of the ceramic substrate and the thin film electrode pattern and between the thin film electrode patterns due to an etchant can be prevented and the binding strength of the entire thin film electrode pattern can be enhanced, resulting in securing durability and reliability of the thin film electrode patterns.