The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 04, 2015
Filed:
Sep. 07, 2009
Eijiro Aoyagi, Kisarazu, JP;
Hongyuan Wang, Kisarazu, JP;
Noriyuki Kirikae, Kisarazu, JP;
Katsufumi Hiraishi, Tokyo, JP;
Eijiro Aoyagi, Kisarazu, JP;
Hongyuan Wang, Kisarazu, JP;
Noriyuki Kirikae, Kisarazu, JP;
Katsufumi Hiraishi, Tokyo, JP;
NIPPON STEEL & SUMIKIN CHEMICAL CO., LTD., Tokyo, JP;
Abstract
A highly heat conductive metal-clad laminate, which may be included in a highly heat conductive polyimide film, has a metal layer on one or both sides of an insulating layer which has a heat conductive filler-filled polyimide layer. The insulating layer of the highly heat conductive metal-clad laminate or the highly heat conductive polyimide film having the filler-filled polyimide layer is characterized in that the content of the heat conductive filler in the filler-filled polyimide layer is 20-80 wt %, the heat conductive filler contains a plate-like filler with an average length Dof 0.1-15 μm and a spherical filler with an average particle diameter Dof 0.05-10 μm, Dand Dsatisfy the relationship D>D/2, no heat conductive filler of 30 μm or more is contained, and the coefficient of thermal expansion is in the range of 10-30 ppm/K.