The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 04, 2015
Filed:
Jul. 17, 2013
Applicant:
Marvell World Trade Ltd., St. Michael, BB;
Inventors:
Shimon Podval, Rishon LeZion, IL;
Amihud Rothmann, Haifa, IL;
Assignee:
Marvell World Trade Ltd., St. Michael, BB;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 5/00 (2006.01); H05K 1/02 (2006.01); H05K 3/30 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0296 (2013.01); H05K 1/183 (2013.01); H05K 3/30 (2013.01); H05K 2201/09181 (2013.01); H05K 2201/10734 (2013.01); Y10T 29/49128 (2015.01);
Abstract
Aspects of the disclosure provide a circuit that includes a printed circuit board (PCB) substrate formed with an opening portion that is dimensioned to accommodate an integrated circuit (IC) package. When the IC package is disposed in the opening portion and is electrically coupled to the PCB substrate for PCB assembling, a thickness of the assembled PCB is less than a thickness sum of the IC package and the PCB substrate.
Quick Actions:
Podval, Shimon. (2015). Ic package and assembly (U.S. Patent No. 9101058). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9101058
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile