logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9099979 B1

PDFFull Text
Date of Patent:
Aug. 04, 2015

Filed:

Jul. 26, 2013

High-frequency circuit module

Applicant:

Taiyo Yuden Co., Ltd., Tokyo, JP;

Inventors:

Hiroshi Nakamura, Tokyo, JP;

Tomohiro Igarashi, Tokyo, JP;

Assignee:

Taiyo Yuden Co., Ltd., Tokyo, JP;

Attorney:

Edell, Shapiro & Finnan LLC

Primary Examiner:

Tuan T Dinh

Int. Cl.
CPC ...
H05K 1/18 (2006.01); H03H 1/00 (2006.01); H05K 1/02 (2006.01); H01L 23/373 (2006.01); H03H 7/46 (2006.01); H03H 9/08 (2006.01); H04B 1/44 (2006.01); H04L 5/14 (2006.01); H05K 3/46 (2006.01); H03H 11/34 (2006.01); H01L 23/367 (2006.01); H03H 9/05 (2006.01); H04B 1/58 (2006.01);
U.S. Cl.
CPC ...
H03H 1/0007 (2013.01); H01L 23/3677 (2013.01); H01L 23/3735 (2013.01); H03H 7/463 (2013.01); H03H 9/08 (2013.01); H03H 11/344 (2013.01); H03H 11/348 (2013.01); H04B 1/44 (2013.01); H04L 5/14 (2013.01); H05K 1/0206 (2013.01); H05K 1/0207 (2013.01); H05K 1/0216 (2013.01); H05K 1/185 (2013.01); H05K 3/4608 (2013.01); H01L 2924/0002 (2013.01); H03H 9/0566 (2013.01); H03H 2001/0085 (2013.01); H04B 1/58 (2013.01); H05K 1/0237 (2013.01); H05K 1/0243 (2013.01);
Abstract

A high-frequency circuit module having a high mounting density is provided. The high-frequency circuit module includes an RFIC configured to transmit and receive a high-frequency signal, a power amplifier IC configured to amplify a transmission signal output from the RFIC, and duplexers configured to separate the transmission signal output from the power amplifier IC and input to an antenna and a received signal from the antenna and input to the RFIC from each other, wherein at least one of the RFIC and power amplifier IC is embedded in the circuit board, and the duplexers are disposed between the RFIC and the power amplifier IC.

Find Patent Forward Citations

Loading…