The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 04, 2015

Filed:

Apr. 25, 2014
Applicant:

Bse Co., Ltd., Incheon, KR;

Inventors:

Sang Ho Lee, Incheon, KR;

Yong Hyun Shim, Incheon, KR;

Assignee:

BSE CO., LTD., Incheon, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/84 (2006.01); H04R 19/04 (2006.01); B81B 3/00 (2006.01); B81B 7/00 (2006.01);
U.S. Cl.
CPC ...
H01L 29/84 (2013.01); B81B 3/0021 (2013.01); B81B 7/0032 (2013.01); B81B 7/0035 (2013.01); B81B 7/0061 (2013.01); H04R 19/04 (2013.01); H04R 2201/003 (2013.01);
Abstract

A micro-electro mechanical system (MEMS) microphone includes: a printed circuit substrate; a MEMS chip that is combined with the printed circuit substrate and has a MEMS inner space; and a case that is combined with the printed circuit substrate, accommodates the MEMS chip, and forms an inner space that is separated from an external space, wherein the case is a double-type case including an inner case and an outer case, a medium acoustic path space is formed between the inner case and the outer case, and the printed circuit substrate includes a substrate acoustic path that connects the medium acoustic path space to the MEMS inner space of the MEMS chip so that external sound passing through the sound hole enters the MEMS inner space of the MEMS chip after passing through the medium acoustic path space.


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