The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 04, 2015
Filed:
Mar. 07, 2014
Applicant:
Semiconductor Components Industries, Llc, Phoenix, AZ (US);
Inventors:
Jan {hacek over (S)}ik, {hacek over (C)}eladná, CZ;
Petr Kostelník, Fren{hacek over (s)}tát pod Radho{hacek over (s)}t{hacek over (e)}m, CZ;
Luká{hacek over (s)} Válek, St{hacek over (r)}íte{hacek over (z)} nad Be{hacek over (c)}vou, CZ;
Michal Lorenc, Frýdek-Místek, CZ;
Milo{hacek over (s)} Pospí{hacek over (s)}il, Ro{hacek over (z)}nov pod Radho{hacek over (s)}t{hacek over (e)}m, CZ;
David Lysá{hacek over (c)}ek, Za{hacek over (s)}ová, CZ;
John Michael Parsey, Jr., Phoenix, AZ (US);
Assignee:
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Phoenix, AZ (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/302 (2006.01); H01L 31/113 (2006.01); H01L 29/06 (2006.01); H01L 23/544 (2006.01); H01L 21/268 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
H01L 23/544 (2013.01); H01L 21/2686 (2013.01); H01L 22/20 (2013.01); H01L 22/12 (2013.01); H01L 2223/54406 (2013.01); H01L 2223/54433 (2013.01); H01L 2223/54453 (2013.01);
Abstract
In one embodiment, methods for making semiconductor devices are disclosed.