The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 04, 2015

Filed:

Feb. 23, 2012
Applicants:

F. Patrick Mccluskey, Ellicott City, MD (US);

Avram Bar-cohen, Bethesda, MD (US);

Peng Wang, Laurel, MD (US);

Inventors:

F. Patrick McCluskey, Ellicott City, MD (US);

Avram Bar-Cohen, Bethesda, MD (US);

Peng Wang, Laurel, MD (US);

Assignee:

UNIVERSITY OF MARYLAND, COLLEGE PARK, College Park, MD (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H01L 23/38 (2006.01); G06F 1/20 (2006.01); H01L 23/34 (2006.01);
U.S. Cl.
CPC ...
H01L 23/38 (2013.01); G06F 1/20 (2013.01); H01L 23/34 (2013.01); H05K 7/209 (2013.01); H05K 7/20254 (2013.01); H01L 2924/0002 (2013.01); Y10T 29/49826 (2015.01);
Abstract

One embodiment includes a power module. The power module includes a power switching device, at least one spot cooler and a base cooler. The at least one spot cooler and base cooler are configured to lower an average surface junction temperature and to isothermalize the surface junction temperature of the power switching device. The at least one spot cooler is embedded in at least one of a heat sink base or base cooler of the power module, and the at least one of the heat sink base or base cooler are attached onto a double side metalized substrate that is attached to the power switching device. In one embodiment, the power module further includes a trench structure cut into the double side metalized substrate.


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