The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 04, 2015
Filed:
Nov. 04, 2011
Yasushi Nomura, Osaka, JP;
Atsushi Ito, Osaka, JP;
Akinori Ooishi, Yokkaichi, JP;
Takahiro Onizuka, Yokkaichi, JP;
Yoshiaki Matsutani, Yokkaichi, JP;
Yasushi Nomura, Osaka, JP;
Atsushi Ito, Osaka, JP;
Akinori Ooishi, Yokkaichi, JP;
Takahiro Onizuka, Yokkaichi, JP;
Yoshiaki Matsutani, Yokkaichi, JP;
Sumitomo Electric Industries, Ltd., Osaka-shi, JP;
Abstract
A reactorof the present invention includes: a combined productprovided with a coiland a magnetic corewhere the coilis disposed; and a casestoring the combined product. The caseincludes: a bottom plate portionfixed to a fixation target when the reactoris installed in the fixation target; a side wall portionattached to the bottom plate portionto surround the combined product; and a heat dissipation layerformed on the inner face of the bottom plate portionto be interposed between the bottom plate portionand the coil. The bottom plate portionis made of aluminum, and the side wall portionis made of an insulating resin. The heat dissipation layeris made of an adhesive agent whose thermal conductivity is high and which exhibits an excellent insulating characteristic. Since the bottom plate portionis structured as a separate member from the side wall portion, the heat dissipation layercan easily be formed and, moreover, the heat dissipation layercan be made of a material possessing an excellent heat dissipating characteristic. Since the insulatorevenly presses the coilagainst the heat dissipation layer, an even more excellent heat dissipating characteristic is achieved.