The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 04, 2015

Filed:

Dec. 07, 2011
Applicants:

Wei Zhang, Princeton, NJ (US);

Niraj K. Jha, Westfield, NJ (US);

LI Shang, Boulder, CO (US);

Inventors:

Wei Zhang, Princeton, NJ (US);

Niraj K. Jha, Westfield, NJ (US);

Li Shang, Boulder, CO (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03K 19/177 (2006.01); G11C 11/406 (2006.01); H01L 51/00 (2006.01);
U.S. Cl.
CPC ...
G11C 11/40615 (2013.01); H03K 19/1778 (2013.01); H03K 19/17752 (2013.01); H03K 19/17776 (2013.01); H01L 51/0052 (2013.01);
Abstract

A hybrid nanotube, high-performance, dynamically reconfigurable architecture, NATURE, is provided, and a design optimization flow method and system, NanoMap. A run-time reconfigurable architecture is provided by associating a non-volatile universal memory to each logic element to enable cycle-by-cycle reconfiguration and logic folding, while remaining CMOS compatible. Through logic folding, significant logic density improvement and flexibility in performing area-delay tradeoffs are possible. NanoMap incorporates temporal logic folding during the logic mapping, temporal clustering and placement steps. NanoMap provides for automatic selection of a best folding level, and uses force-direct scheduling to balance resources across folding stages. Mapping can thereby target various optimization objectives and user constraints. A high-density, high-speed carbon nanotube RAM can be implemented as the universal memory, allowing on-chip multi-context configuration storage, enabling fine-grain temporal logic folding, and providing a significant increase in relative logic density.


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