The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 04, 2015

Filed:

Jul. 02, 2010
Applicants:

Jean-luc Garaud, Comines, FR;

Guillaume Kergosien, Chaville, FR;

Xavier Thomas, Famars, FR;

Inventors:

Jean-Luc Garaud, Comines, FR;

Guillaume Kergosien, Chaville, FR;

Xavier Thomas, Famars, FR;

Assignee:

Dow Corning Corporation, Midland, MI (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A61K 47/34 (2006.01); C08G 77/12 (2006.01); C08L 83/04 (2006.01); C09D 183/04 (2006.01); C08G 77/20 (2006.01); C08G 77/00 (2006.01);
U.S. Cl.
CPC ...
C08G 77/12 (2013.01); C08L 83/04 (2013.01); C09D 183/04 (2013.01); C08G 77/20 (2013.01); C08G 77/70 (2013.01); C08G 77/80 (2013.01);
Abstract

The invention relates to silicone containing compositions able to form adhesive films on substrates, which typically comprises a curable silicone composition comprising components (a), (d) and at least one of (b) or (c): a. a polyorganosiloxane resin, composed of M and Q units having at least 3 alkenyl groups per molecule, herein after called 'SiVi' groups, b. a polyorganosiloxane compound having at least 2 Si-bonded hydrogen groups on the polysiloxane chain, hereinafter called 'SiH' groups, c. a telechelic polyorganosiloxane compound having terminal Si—H groups, and d. a hydrosilylation catalyst for the reaction of SiH groups with SiVi groups, e. a liquid diluent in an amount of from 0% to maximum 40% by weight of composition said components reacting together by hydrosilylation at a temperature below 400 C when they are brought into contact on a substrate and cure to form a continuous film on the substrate. Such formulation can cure quickly at room temperature and can provide good balance between adhesion and tack.


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