The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 04, 2015

Filed:

Aug. 07, 2012
Applicants:

Jun Mitadera, Kanagawa, JP;

Takahiro Takano, Kanagawa, JP;

Inventors:

Jun Mitadera, Kanagawa, JP;

Takahiro Takano, Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 69/26 (2006.01); C08K 7/02 (2006.01); C08L 77/06 (2006.01); B29C 45/00 (2006.01); B29C 45/74 (2006.01); C08J 5/00 (2006.01);
U.S. Cl.
CPC ...
C08G 69/26 (2013.01); B29C 45/0001 (2013.01); B29C 45/74 (2013.01); C08G 69/265 (2013.01); C08J 5/00 (2013.01); C08K 7/02 (2013.01); C08L 77/06 (2013.01);
Abstract

Provided is a thin-wall article formed from a polyamide resin which can be stably produced with little variation in mechanical properties such as flexural strength, flexural modulus and impact resistance. A thin-wall article formed by molding a polyamide resin (C) obtained by polycondensing a diamine (A) and a dicarboxylic acid (B) or a polyamide resin composition containing the polyamide resin, wherein 70 mol % or more of a diamine structural unit is derived from xylylenediamine and the polyamide resin has a melt viscosity (i) of 50 to 200 Pa·s as measured at a temperature of the melting point plus 10° C. for a holding time of 6 minutes at a shear rate of 122 sec.


Find Patent Forward Citations

Loading…