The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 04, 2015

Filed:

Aug. 30, 2010
Applicants:

Minoru Onodera, Kurashiki, JP;

Tadao Yoshikawa, Kurashiki, JP;

Inventors:

Minoru Onodera, Kurashiki, JP;

Tadao Yoshikawa, Kurashiki, JP;

Assignee:

KURARAY CO., LTD., Kurashiki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 15/08 (2006.01); B32B 37/20 (2006.01); H05K 1/03 (2006.01); H05K 3/00 (2006.01); B29C 65/18 (2006.01); B29C 65/00 (2006.01); B29K 101/12 (2006.01); B29K 105/00 (2006.01); B29K 305/00 (2006.01); B29L 9/00 (2006.01); B29L 31/34 (2006.01); B32B 38/00 (2006.01); H05K 3/02 (2006.01);
U.S. Cl.
CPC ...
B32B 37/20 (2013.01); B29C 66/83221 (2013.01); B29C 66/83413 (2013.01); B29C 66/9141 (2013.01); B29C 66/91421 (2013.01); B29C 66/91645 (2013.01); B29C 66/91931 (2013.01); B29C 66/91933 (2013.01); B29C 66/91935 (2013.01); B32B 15/08 (2013.01); H05K 1/0313 (2013.01); H05K 3/0011 (2013.01); B29C 65/18 (2013.01); B29C 66/034 (2013.01); B29C 66/7352 (2013.01); B29C 66/73111 (2013.01); B29C 66/742 (2013.01); B29C 66/919 (2013.01); B29K 2101/12 (2013.01); B29K 2105/0079 (2013.01); B29K 2305/00 (2013.01); B29L 2009/003 (2013.01); B29L 2031/3425 (2013.01); B32B 38/0036 (2013.01); B32B 2305/55 (2013.01); B32B 2307/734 (2013.01); B32B 2311/00 (2013.01); H05K 3/022 (2013.01); H05K 2201/0141 (2013.01); H05K 2201/068 (2013.01); H05K 2203/1105 (2013.01); Y10T 428/1086 (2015.01);
Abstract

A metal-clad laminate excellent in isotropy, appearance, bondability between a TLC polymer film and a metallic sheet, and dimensional stability is provided less costly with a first step of thermally compressing the film with the metallic sheet by passing them through a nipping region between heating rolls, and a second step of heat-treating the resultant metal-clad laminate at a temperature not higher than the melting point of the film, wherein the film has thermal expansion coefficient αsatisfying α=βT+γ with thickness T, thickness coefficient β and anisotropy coefficient γ of the film; wherein the coefficient β is within the range of −0.08 to −0.01; the coefficient γ is within the range of α+6≦γ≦α+10 with thermal expansion coefficient αof the metallic sheet; and thermal expansion coefficient αof the film is within α−2≦α≦α+3 with the coefficient α.


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