The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 04, 2015

Filed:

Oct. 27, 2008
Applicants:

Ramasamy Anbarasu, Karnataka, IN;

Ashwit Dias, Goa, IN;

OM Prakash, Karnataka, IN;

Milind S. Paradkar, Karnataka, IN;

Daniel Wardell Sowle, Dalton, MA (US);

Anshuman Tripathi, Allahabad, IN;

Inventors:

Ramasamy Anbarasu, Karnataka, IN;

Ashwit Dias, Goa, IN;

Om Prakash, Karnataka, IN;

Milind S. Paradkar, Karnataka, IN;

Daniel Wardell Sowle, Dalton, MA (US);

Anshuman Tripathi, Allahabad, IN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 45/73 (2006.01); B29C 33/04 (2006.01); B29C 33/06 (2006.01); B29C 35/08 (2006.01);
U.S. Cl.
CPC ...
B29C 45/73 (2013.01); B29C 33/04 (2013.01); B29C 33/06 (2013.01); B29C 2035/0811 (2013.01); B29C 2035/0816 (2013.01); B29C 2045/7368 (2013.01); B29C 2045/7393 (2013.01);
Abstract

Various systems and methods for forming a polymer part with utilizing heating fluid are provided. In one embodiment of the present invention a method for forming polymer includes heating the mold apparatus with a first heat energy source comprising heating fluid to a first mold temperature, and then heating the mold apparatus with a second energy source which is different than the first energy source. The second energy source heats the mold surface to a second mold temperature greater than the first mold temperature to form the part to achieve a desired surface finish of the polymer part.


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