The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 04, 2015
Filed:
Dec. 26, 2012
Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd., Shenzhen, CN;
Hon Hai Precision Industry Co., Ltd., New Taipei, TW;
Wen-Chang Chen, New Taipei, TW;
Shin-Wen Chen, New Taipei, TW;
Yu-Tsan Cheng, New Taipei, TW;
Yu-Shu Lin, New Taipei, TW;
Chien-Liang Chou, New Taipei, TW;
Zuo-Qing Yao, Shenzhen, CN;
HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD., Shenzhen, CN;
HON HAI PRECISION INDUSTRY CO., LTD., New Taipei, TW;
Abstract
An apparatus for assembling camera modules to flexible printed circuit boards (PCBs) includes a number of trays, a surface mounting device used in surface mount technology (SMT) for PCBs, and a hot pressing device. Workpieces, each of which includes a flexible PCB (FPCB) and a lens module positioned on the FPCB, are received in the trays. Each tray is sent to the surface mounting device. The surface mounting device loads and pastes a stiffener onto a FBCB, opposite to a lens module. The hot pressing device hot presses each stiffener to the respective workpiece, which is received in each tray sent from the surface mounting device, to fixedly secure the stiffener to the respective workpiece to form a camera module.