The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 04, 2015
Filed:
Sep. 26, 2012
Applicants:
Nicolaas Johannes Anthonius Van Veen, Eindhoven, NL;
Hossain Mohammad Biglari, The Hague, NL;
Inventors:
Nicolaas Johannes Anthonius Van Veen, Eindhoven, NL;
Hossain Mohammad Biglari, The Hague, NL;
Assignee:
KONINKLIJKE PHILIPS N.V., Eindhoven, NL;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 35/24 (2006.01); B23K 35/26 (2006.01); B23K 35/28 (2006.01); B23K 35/02 (2006.01); H05K 3/34 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
B23K 35/0222 (2013.01); B23K 35/24 (2013.01); B23K 35/26 (2013.01); B23K 35/262 (2013.01); B23K 35/264 (2013.01); B23K 35/28 (2013.01); B23K 35/286 (2013.01); H01L 24/29 (2013.01); H05K 3/3484 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/29109 (2013.01); H01L 2224/29111 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48464 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/0132 (2013.01); H01L 2924/0133 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/01327 (2013.01); H01L 2924/13091 (2013.01); H05K 2201/0215 (2013.01); Y10T 428/1216 (2015.01); Y10T 428/12028 (2015.01); Y10T 428/24826 (2015.01); Y10T 428/31678 (2015.04);
Abstract
The solder composition comprises particles of a thermodynamically metastable alloy. One of the elements of the alloy will form an intermetallic compound with a metal surface. The solder composition is particularly suitable for use in bumping of semiconductor devices.