The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 28, 2015
Filed:
Sep. 16, 2011
Janusz Bryzek, Oakland, CA (US);
John Gardner Bloomsburgh, Oakland, CA (US);
Cenk Acar, Irvine, CA (US);
Janusz Bryzek, Oakland, CA (US);
John Gardner Bloomsburgh, Oakland, CA (US);
Cenk Acar, Irvine, CA (US);
Fairchild Semiconductor Corporation, San Jose, CA (US);
Abstract
This document refers to multi-die micromechanical system (MEMS) packages. In an example, a multi-die MEMS package can include a controller integrated circuit (IC) configured to couple to a circuit board, a MEMS IC mounted to a first side of the controller IC, a through silicon via extending through the controller IC between the first side and a second side of the controller IC, the second side opposite the first side, and wherein the MEMS IC is coupled to the through silicon via.