The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 28, 2015

Filed:

Jul. 14, 2014
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon, Gyunggi-do, KR;

Inventors:

Myung Whun Chang, Seoul, KR;

Dae Hyeong Lee, Seoul, KR;

Ki Pyo Hong, Gyunggi-do, KR;

Assignee:

SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-Si, Gyeonggi-Do, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/09 (2006.01); H05K 1/00 (2006.01); H01K 3/10 (2006.01); H05K 1/11 (2006.01); H05K 3/22 (2006.01); G01R 1/02 (2006.01); H05K 3/40 (2006.01);
U.S. Cl.
CPC ...
H05K 1/11 (2013.01); G01R 1/02 (2013.01); H05K 3/225 (2013.01); H05K 1/09 (2013.01); H05K 3/4015 (2013.01); H05K 3/4061 (2013.01); Y10T 29/49002 (2015.01); Y10T 29/49149 (2015.01); Y10T 29/49165 (2015.01); Y10T 29/49726 (2015.01); Y10T 29/49748 (2015.01);
Abstract

There is provided a method of repairing a probe board, the method including: preparing a plurality of first via electrodes filled with a first filling material in a board body formed as a ceramic sintered body; forming a via hole for an open via electrode among the plurality of first via electrodes; filling the via hole with a second filling material having a lower sintering temperature than that of the first filling material; and forming a second via electrode by sintering the second filling material. The open via repair according to the present invention improves the manufacturing yield of the board and reduces the manufacturing costs thereof.


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