The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 28, 2015

Filed:

Nov. 14, 2012
Applicant:

Samsung Display Co., Ltd., Yongin, Gyeonggi-Do, KR;

Inventors:

Hyang-Shik Kong, Seongnam-si, KR;

Seung-Bo Shim, Asan-si, KR;

Jin-Ho Ju, Seoul, KR;

Jun-Gi Kim, Seoul, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/311 (2006.01); H01L 29/786 (2006.01); H01L 21/02 (2006.01); H01L 29/66 (2006.01); H01L 21/027 (2006.01); H01L 21/321 (2006.01);
U.S. Cl.
CPC ...
H01L 29/786 (2013.01); H01L 21/0274 (2013.01); H01L 21/02697 (2013.01); H01L 21/32115 (2013.01); H01L 29/66765 (2013.01); H01L 29/78603 (2013.01); H01L 29/7869 (2013.01);
Abstract

A method of planarizing a substrate includes forming a conductive pattern on a first surface of a base substrate, forming a positive photoresist layer on the base substrate and the conductive pattern, exposing the positive photoresist layer to light by irradiating a second surface of the base substrate opposite to the first surface with light, developing the positive photoresist layer to form a protruded portion on the conductive pattern, forming a planarizing layer on the base substrate and the protruded portion and eliminating the protruded portion.


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