The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 28, 2015

Filed:

Apr. 23, 2007
Applicant:

Harry J. Levinson, Saratoga, CA (US);

Inventor:

Harry J. Levinson, Saratoga, CA (US);

Assignee:

GLOBALFOUNDRIES, Inc., Grand Cayman, KY;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 21/67 (2006.01); G03F 7/20 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67028 (2013.01); G03F 7/70925 (2013.01); H01L 21/02057 (2013.01); H01L 21/67011 (2013.01);
Abstract

In one disclosed embodiment, the present method for semiconductor fabrication utilizing a cleaning substrate comprises loading a cleaning substrate capable of removing an undesirable particle from a semiconductor processing tool onto the tool, causing the undesirable particle to be attracted to the cleaning substrate, and unloading the cleaning substrate from the semiconductor processing tool. Following cleaning, the processing tool can be used for producing a lithographic pattern on a semiconductor wafer. In one embodiment, the cleaning substrate comprises an electret. In another embodiment, the cleaning substrate comprises an adhesive layer. The present method can be used without breaking vacuum, or otherwise altering the operational state of a processing tool. In one embodiment, the present method is used in conjunction with an exposure tool utilized for high resolution lithography, for example, an extreme ultraviolet (EUV) lithographic exposure tool.


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