The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 28, 2015
Filed:
Mar. 14, 2014
Applicant:
Lockheed Martin Corporation, Bethesda, MD (US);
Inventors:
Duc Huynh, Princeton Junction, NJ (US);
Wilbur Lew, Mount Laurel, NJ (US);
Assignee:
Lockheed Martin Corporation, Bethesda, MD (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01); H01L 23/552 (2006.01); H01L 23/498 (2006.01); H01L 23/367 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49838 (2013.01); H01L 23/367 (2013.01); H01L 24/97 (2013.01);
Abstract
An integrated circuit package is provided. The package includes a housing on which at least one semiconductor device is mounted, active side up. A substrate having a transmission line formed on or within a first dielectric layer thereof is provided. The transmission line is arranged between the active side of the semiconductor device and at least one input or output port of the package for providing an electrical connection therebetween.