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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9093441 B1

PDFFull Text
Expired
Date of Patent:
Jul. 28, 2015

Filed:

Mar. 18, 2013

Semiconductor packages including semiconductor chips having protrusions and methods of fabricating the same

Applicant:

SK Hynix Inc., Icheon-si Gyeonggi-do, KR;

Inventors:

Ji Eun Kim, Suwon-si, KR;

Cheol Ho Joh, Icheon-si, KR;

Hee Min Shin, Seongnam-si, KR;

Kyu Won Lee, Seoul, KR;

Chong Ho Cho, Incheon, KR;

Assignee:

SK Hynix Inc., Gyeonggi-do, KR;

Attorney:

William Park & Associates Ltd.

Primary Examiner:

Phat X Cao

Int. Cl.
CPC ...
H01L 25/04 (2014.01); H01L 25/065 (2006.01); H01L 25/075 (2006.01); H01L 23/498 (2006.01); H01L 21/683 (2006.01); H01L 25/00 (2006.01); H01L 29/06 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49827 (2013.01); H01L 21/6836 (2013.01); H01L 24/92 (2013.01); H01L 25/043 (2013.01); H01L 25/0652 (2013.01); H01L 25/0657 (2013.01); H01L 25/0756 (2013.01); H01L 25/50 (2013.01); H01L 29/0657 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 24/78 (2013.01); H01L 2221/68327 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/49174 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/78346 (2013.01); H01L 2224/92247 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06562 (2013.01); H01L 2924/1531 (2013.01);
Abstract

The semiconductor package includes an upper semiconductor chip stacked on a package substrate and a support layer or a lower semiconductor chip disposed between the upper semiconductor chip and the package substrate. The upper semiconductor chip includes a protrusion downwardly extending from an edge thereof. The protrusion of the upper semiconductor chip is combined with a sidewall of the support layer or the lower semiconductor chip. Related methods are also provided.

Find Patent Forward Citations

Kim, Ji. (2015). Semiconductor packages including semiconductor chips having protrusions and methods of fabricating the same (U.S. Patent No. 9093441). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9093441

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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