The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 28, 2015
Filed:
Nov. 03, 2011
Applicant:
Gregory Dix, Tempe, AZ (US);
Inventor:
Gregory Dix, Tempe, AZ (US);
Assignee:
MICROCHIP TECHNOLOGY INCORPORATED, Chandler, AZ (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/482 (2006.01); H01L 23/495 (2006.01); H01L 23/00 (2006.01); H01L 29/417 (2006.01); H01L 29/423 (2006.01); H01L 29/78 (2006.01);
U.S. Cl.
CPC ...
H01L 23/4824 (2013.01); H01L 23/49562 (2013.01); H01L 23/49575 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 29/41758 (2013.01); H01L 29/4238 (2013.01); H01L 29/7816 (2013.01); H01L 2224/16245 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/49173 (2013.01); H01L 2224/49175 (2013.01); H01L 2224/49177 (2013.01); H01L 2924/1305 (2013.01);
Abstract
A semiconductor power chip may have a semiconductor die having a power device fabricated on a substrate thereof, wherein the power device has at least one first contact element, a plurality of second contact elements and a plurality of third contact elements arranged on top of the semiconductor die; a plurality of ball bumps or a loaf bump disposed on each of the plurality of second elements and the plurality of third elements; and at least one ball bump or loaf on the at least one first contact element.