The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 28, 2015
Filed:
Sep. 23, 2011
Applicants:
Akio Iwabuchi, Niiza, JP;
Hironori Aoki, Niiza, JP;
Inventors:
Akio Iwabuchi, Niiza, JP;
Hironori Aoki, Niiza, JP;
Assignee:
SANKEN ELECTRIC CO., LTD., Saitama, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/482 (2006.01); H01L 29/40 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/4824 (2013.01); H01L 29/404 (2013.01); H01L 24/05 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/05553 (2013.01); H01L 2224/05624 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/05666 (2013.01);
Abstract
A semiconductor device is free from degradation of characteristics attributable to a manufacturing process thereof and its characteristics are hardly affected by changes in electric potentials of bonding pads. The semiconductor deviceincludes an active region, a first insulating layercovering the active region, a floating conductorformed on the first insulating layer, a second insulating layerformed on the first insulating layerand the floating conductor, a bonding padformed on the second insulating layerand interconnection viasfor electrically connecting the active regionand the bonding pad