The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 28, 2015
Filed:
Nov. 07, 2014
Applicant:
Mitsubishi Electric Corporation, Tokyo, JP;
Inventors:
Tadayoshi Hata, Nagasaki, JP;
Keizo Ogata, Nagasaki, JP;
Assignee:
MITSUBISHI ELECTRIC CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/10 (2006.01); B65D 55/10 (2006.01); H01L 23/04 (2006.01);
U.S. Cl.
CPC ...
H01L 23/10 (2013.01); B65D 55/10 (2013.01); H01L 23/04 (2013.01);
Abstract
A semiconductor device includes: a package including a base plate and a side wall located on a perimeter of the base plate; a semiconductor element on the base plate; and a lid joined to a top of the side wall and covering the semiconductor element, wherein a first curved surface is located inside the package at the top of the side wall, a second curved surface is located on a perimeter of an undersurface of the lid, and the first curved surface of the side wall contacts the second curved surface of the lid.