The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 28, 2015

Filed:

Feb. 25, 2011
Applicants:

Thomas F. Greenfield, Kings Park, NY (US);

Gannon T. Gambeski, Saint James, NY (US);

David P. Eckel, Fort Salonga, NY (US);

Michael Glater, Brooklyn, NY (US);

John M. Reilly, Port Jefferson, NY (US);

Seckin K. Secilmis, Seaford, NY (US);

William J. Zbytniewski, West Babylon, NY (US);

Inventors:

Thomas F. Greenfield, Kings Park, NY (US);

Gannon T. Gambeski, Saint James, NY (US);

David P. Eckel, Fort Salonga, NY (US);

Michael Glater, Brooklyn, NY (US);

John M. Reilly, Port Jefferson, NY (US);

Seckin K. Secilmis, Seaford, NY (US);

William J. Zbytniewski, West Babylon, NY (US);

Assignee:

B/E AEROSPACE, INC., Wellington, FL (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B60Q 1/06 (2006.01); F21V 23/02 (2006.01); F21S 4/00 (2006.01); F21V 3/00 (2015.01); F21V 15/01 (2006.01); F21V 15/015 (2006.01); F21V 17/16 (2006.01); F21V 21/02 (2006.01); F21V 27/00 (2006.01); F21V 29/00 (2015.01); F21W 101/06 (2006.01); F21W 101/08 (2006.01); F21Y 101/02 (2006.01); F21Y 103/00 (2006.01);
U.S. Cl.
CPC ...
F21V 23/02 (2013.01); F21S 4/008 (2013.01); F21V 3/00 (2013.01); F21V 15/01 (2013.01); F21V 15/013 (2013.01); F21V 15/015 (2013.01); F21V 17/164 (2013.01); F21V 21/02 (2013.01); F21V 27/00 (2013.01); F21V 29/004 (2013.01); F21W 2101/06 (2013.01); F21W 2101/08 (2013.01); F21Y 2101/02 (2013.01); F21Y 2103/003 (2013.01); Y10T 29/49117 (2015.01);
Abstract

An LED lighting element having an H-shaped housing. The housing, which may be an extruded housing, has a first section and a second section which is separated from the first section by a cross bar. A back plate is positioned opposite of the crossbar and is removably secured to the first section. A heat sink is located within the housing while a microcontroller and LED drive/control technology and integrated power supply contacts the heat sink and is attached to the back plate. An LED PC board that is electrically connected to the microcontroller and LED drive/control technology and integrated power supply is positioned in the second section and is attached to the housing. An end cap for the housing along with a method for constructing the lighting element are also disclosed.


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