The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 28, 2015

Filed:

Aug. 25, 2011
Applicants:

Hyo Tae Kim, Seoul, KR;

Gi Seok Song, Gyeonggi-do, KR;

Heung Soon Kim, Gyeonggi-do, KR;

Inventors:

Hyo Tae Kim, Seoul, KR;

Gi Seok Song, Gyeonggi-do, KR;

Heung Soon Kim, Gyeonggi-do, KR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F21S 4/00 (2006.01); F21V 21/00 (2006.01); F21V 29/00 (2015.01); H05K 1/02 (2006.01); H01L 33/64 (2010.01); H05K 1/05 (2006.01);
U.S. Cl.
CPC ...
F21V 29/004 (2013.01); H05K 1/0203 (2013.01); H01L 33/648 (2013.01); H05K 1/053 (2013.01); H05K 2201/017 (2013.01); H05K 2201/064 (2013.01); H05K 2201/10106 (2013.01); H05K 2201/10969 (2013.01);
Abstract

The present invention provides an LED array module having an improved heat-dissipating effect, and a manufacturing method thereof. To this end, an LED array module includes one or more LED unit modules, the LED unit module comprising: an LED; a heat conductive heat-dissipating slug attached to the lower portion of the LED; and leads connected to the cathode and anode of the LED, respectively, wherein the LED array module comprises: a heat-dissipating plate; a heat conductive solder layer disposed and bonded between the upper surface of the heat-dissipating plate and the lower surface of the heat-dissipating slug; a first insulating layer formed on the upper surface of the heat-dissipating plate; and array electrodes which are formed on the upper surface of the insulating layer and are electrically connected to the leads to drive the LED.


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