The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 28, 2015

Filed:

Sep. 17, 2013
Applicant:

3form, Inc., Salt Lake City, UT (US);

Inventors:

M. Hoyt Brewster, Salt Lake City, UT (US);

Charles H. Moore, Salt Lake City, UT (US);

John E. C. Willham, Sandy, UT (US);

Assignee:

3form, LLC, Salt Lake City, UT (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 3/12 (2006.01); A47H 15/00 (2006.01); A47H 13/00 (2006.01); E06B 3/00 (2006.01); E06B 9/00 (2006.01); E04C 2/24 (2006.01); E04B 9/04 (2006.01); E04B 9/32 (2006.01); E04C 2/20 (2006.01); E04C 2/36 (2006.01); E04C 2/54 (2006.01); E04F 10/00 (2006.01); E06B 5/00 (2006.01); B32B 7/02 (2006.01);
U.S. Cl.
CPC ...
E04C 2/24 (2013.01); B32B 3/12 (2013.01); B32B 7/02 (2013.01); E04B 9/045 (2013.01); E04B 9/32 (2013.01); E04C 2/20 (2013.01); E04C 2/36 (2013.01); E04C 2/54 (2013.01); E04F 10/00 (2013.01); E06B 5/00 (2013.01); B32B 2419/04 (2013.01); B32B 2607/00 (2013.01); Y10T 428/24149 (2015.01); Y10T 428/24157 (2015.01); Y10T 428/24942 (2015.01);
Abstract

A structured-core laminate panel can be made in an efficient, structurally sound manner without the use of adhesives (film or liquid forms) using materials with different melt or glass transition temperatures. In one implementation, a manufacturer positions one or more resin substrates about a structured core, which comprises a relatively high melt or glass transition temperature compared with that of the one or more resin substrates. The manufacturer heats the assembly to at least the glass transition temperature of the resin substrates, but not to the melt or glass transition temperature of the structured core. This allows the one or more resin substrates to melt and bond (mechanically, chemically, or both) to the structured core on one side (or inner surface), while maintaining a substantially planar or original conformation on an opposing side (or outer surface).


Find Patent Forward Citations

Loading…