The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 28, 2015

Filed:

Jan. 30, 2014
Applicant:

Pacesetter, Inc., Sunnyvale, CA (US);

Inventors:

Ralph Jason Hemphill, Pickens, SC (US);

David R. Bowen, Taylors, SC (US);

Troy L. McCurry, West Union, SC (US);

Assignee:

Pacesetter, Inc., Sunnyvale, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B44C 1/22 (2006.01); C25F 3/14 (2006.01); C23F 1/00 (2006.01); C23F 1/36 (2006.01); H01G 9/055 (2006.01); H01G 9/045 (2006.01); H01G 9/00 (2006.01);
U.S. Cl.
CPC ...
C25F 3/14 (2013.01); B44C 1/227 (2013.01); C23F 1/00 (2013.01); C23F 1/36 (2013.01); H01G 9/00 (2013.01); H01G 9/0029 (2013.01); H01G 9/045 (2013.01); H01G 9/055 (2013.01);
Abstract

Electrode foils suitable for use in electrolytic capacitors, including those having multiple configurations, have improved strength, reduced brittleness, and increased capacitance compared to conventional anode foils for electrolytic capacitors. Exemplary methods of manufacturing an anode foil suitable for use in an electrolytic capacitor include forming a pattern of etch resist on a surface of a substrate; etching a first area of the surface substantially enclosed by the pattern and a second area in intervals between the pattern to form tunnels in first and second areas of the surface; and removing the resist material revealing a non-etched frame. The resist material may be deposited, for example, by ink-jet printing, stamping or screen printing. Additionally, an etch resist pattern may be used to form strength lines on the substrate surface.


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