The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 28, 2015
Filed:
Mar. 09, 2009
Applicants:
Sung-hwan Choi, Seoul, KR;
Ki-jeong Moon, Seoul, KR;
Hae-sang Jeon, Seoul, KR;
Chang-hoon Sim, Seoul, KR;
Inventors:
Sung-Hwan Choi, Seoul, KR;
Ki-Jeong Moon, Seoul, KR;
Hae-Sang Jeon, Seoul, KR;
Chang-Hoon Sim, Seoul, KR;
Assignee:
TORAY ADVANCED MATERIALS KOREA, INC., Gyeongsangbuk-Do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 7/02 (2006.01); C09J 175/16 (2006.01); C09J 171/00 (2006.01); C08L 75/16 (2006.01); C08L 71/00 (2006.01); C08L 33/08 (2006.01);
U.S. Cl.
CPC ...
C09J 7/0242 (2013.01); C09J 171/00 (2013.01); C08G 2650/56 (2013.01); C08L 33/08 (2013.01); C08L 2312/06 (2013.01); C09J 2463/00 (2013.01); Y10T 428/2878 (2015.01);
Abstract
There is provided an adhesive tape for manufacturing electronic components comprising a heat-resistant substrate and an adhesive layer containing an adhesive composition disposed on the heat-resistant substrate, wherein the adhesive composition comprises a phenoxy resin, a curing agent, an energy ray curable acrylic resin and a photoinitiator, and wherein the adhesive layer is cured by heat and an energy ray.