The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 28, 2015

Filed:

Jul. 21, 2010
Applicants:

Yuji Saga, Utsunomiya, JP;

Narumi Une, Utsunomiya, JP;

Inventors:

Yuji Saga, Utsunomiya, JP;

Narumi Une, Utsunomiya, JP;

Assignee:

Ticona LLC, Florence, KY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08K 3/00 (2006.01); C08K 7/04 (2006.01); C09K 19/02 (2006.01); C09K 19/38 (2006.01); C09K 19/52 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
C08K 3/0008 (2013.01); C08K 7/04 (2013.01); C09K 19/02 (2013.01); C09K 19/3809 (2013.01); C09K 19/52 (2013.01); H05K 7/20481 (2013.01);
Abstract

Thermally conductive thermoplastic resin compositions are provided containing thermoplastic resin and thermally conductive filler and fibrous filler, along with articles made therefrom. In certain instances when the thermally conductive filler and fibrous filer are more restricted, and other ingredients are present, the thermally conductive composition exhibits an improved volume resistibility and is suitable for fabricating a chassis for LCD display. Also described are the thermally conductive resin compositions, especially when the polymer is LCP. Such compositions are useful for items such as electrical and electronic housings requiring highly thermally conduciveness.


Find Patent Forward Citations

Loading…