The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 28, 2015

Filed:

Mar. 24, 2011
Applicants:

Masakazu Iwata, Kyoto, JP;

Kouji Oota, Kyoto, JP;

Inventors:

Masakazu Iwata, Kyoto, JP;

Kouji Oota, Kyoto, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08L 75/14 (2006.01); C08L 33/22 (2006.01); C09D 133/22 (2006.01); C09D 11/10 (2014.01); C09D 175/14 (2006.01); G03G 9/13 (2006.01); G03G 9/12 (2006.01); C08J 3/11 (2006.01); G03G 9/125 (2006.01);
U.S. Cl.
CPC ...
C08J 3/11 (2013.01); G03G 9/125 (2013.01); G03G 9/13 (2013.01); G03G 9/131 (2013.01);
Abstract

Provided is a nonaqueous dispersion of resin particles, in which the resin particles have uniform particle diameters and shapes and which exhibits excellent fixing properties, particularly when used as a liquid electrophotographic developer. More specifically, provided is a nonaqueous dispersion (X) in which resin particles (C) are dispersed in a nonhydrophilic organic solvent (L) that exhibits a relative permittivity of 1 to 4 at 20° C., the resin particles (C) being core-shell type resin particles each of which comprise a resin particle (B) that contains a resin (b) and fine particles (A) that contain a resin (a) and that either adhere to the surface of the resin particle (B) or form a film on the surface of the resin particle (B), wherein the solubility of (a) in (L) at 25° C. is 10 wt % or less relative to the weight of (a).


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