The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 28, 2015

Filed:

Sep. 24, 2009
Applicants:

Yutaka Tanaka, Kuwana, JP;

Katsutoshi Muramatsu, Kuwana, JP;

Inventors:

Yutaka Tanaka, Kuwana, JP;

Katsutoshi Muramatsu, Kuwana, JP;

Assignee:

NTN CORPORATION, Osaka, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24B 11/06 (2006.01); B24B 37/025 (2012.01); B24D 7/18 (2006.01); F16C 33/32 (2006.01);
U.S. Cl.
CPC ...
B24B 37/025 (2013.01); B24B 11/06 (2013.01); B24D 7/18 (2013.01); F16C 33/32 (2013.01); F16C 2206/40 (2013.01);
Abstract

A spherical body polishing apparatus capable of reducing polishing costs includes a rotating disk having a rotating disk polishing surface and a fixed disk having a fixed disk polishing surface opposed to the rotating disk polishing surface. The rotating disk polishing surface is capable of relative rotation while keeping being opposed to the fixed disk polishing surface. The rotating disk polishing surface has a groove portion formed therein and extending circumferentially along the rotation. The rotating disk having the groove portion therein includes an abrasive grain layer having a higher hardness than that of a material ball which is a spherical body and a holding layer formed on the abrasive grain layer and having a lower hardness than that of the abrasive grain layer. The groove portion is formed to penetrate the holding layer in a depth direction and to reach the abrasive grain layer.


Find Patent Forward Citations

Loading…