The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 28, 2015

Filed:

Sep. 22, 2010
Applicants:

Ikkou Hanaki, Ibaraki, JP;

Keiji Hayashi, Ibaraki, JP;

Kazuhito Okumura, Ibaraki, JP;

Inventors:

Ikkou Hanaki, Ibaraki, JP;

Keiji Hayashi, Ibaraki, JP;

Kazuhito Okumura, Ibaraki, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 26/00 (2014.01); B23K 26/38 (2014.01); B23K 26/18 (2006.01); B23K 26/30 (2014.01); B23K 37/06 (2006.01); C09J 7/02 (2006.01);
U.S. Cl.
CPC ...
B23K 26/38 (2013.01); B23K 26/18 (2013.01); B23K 26/427 (2013.01); B23K 37/06 (2013.01); C09J 7/0271 (2013.01); C09J 7/0285 (2013.01); B23K 2203/04 (2013.01); B23K 2203/10 (2013.01); Y10T 428/266 (2015.01);
Abstract

The object of the present invention is provision of a surface protection sheet for laser processing to be applied to the surface on the opposite side of the laser beam irradiation face, which can protect the surface of an application object, and does not allow easy development of a dross during laser cutting processing. According to the present invention, a surface protection sheetfor laser processing to be applied to the surface on the opposite side of the laser beam irradiation faceof a workpieceduring a cutting process by irradiation of a laser beamon the workpieceis provided, which contains a substrate layer and an adhesive layer formed on one surface of the substrate layer, wherein the substrate layer is made of a resin material having a melt viscosity measured based on JIS K7199 (1999) at 290° C. of not more than 200 Pa·s, and has a thickness of 0.01-0.12 mm.


Find Patent Forward Citations

Loading…