The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 28, 2015

Filed:

Apr. 17, 2012
Applicants:

Kenneth C. Crouch, North Andover, MA (US);

Robert W. Tracy, Haverhill, MA (US);

Thomas J. Karlinski, Atkinson, NH (US);

Scott A. Reid, Bradford, MA (US);

Inventors:

Kenneth C. Crouch, North Andover, MA (US);

Robert W. Tracy, Haverhill, MA (US);

Thomas J. Karlinski, Atkinson, NH (US);

Scott A. Reid, Bradford, MA (US);

Assignee:

ILLINOIS TOOL WORKS INC., Glenview, IL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B08B 9/00 (2006.01); B05B 15/02 (2006.01); B05C 11/10 (2006.01); H05K 3/00 (2006.01); B41J 2/165 (2006.01); H05K 3/34 (2006.01); H05K 3/12 (2006.01);
U.S. Cl.
CPC ...
B05B 15/0258 (2013.01); B41J 2/16552 (2013.01); B05C 11/1002 (2013.01); B41J 2002/16555 (2013.01); B41J 2202/02 (2013.01); H05K 3/0091 (2013.01); H05K 3/1225 (2013.01); H05K 3/3484 (2013.01); H05K 2203/013 (2013.01); H05K 2203/0126 (2013.01); H05K 2203/081 (2013.01);
Abstract

A method for cleaning a nozzle of a material deposition system configured to deposit material on an electronic substrate includes: performing a deposition operation with a material deposition system configured to position an electronic substrate under a deposition head movable by a gantry, to supply material to a chamber of the deposition head, to extend a piston of the deposition head from the chamber, the needle terminating in a needle orifice, and to push a volume of material out of the chamber by an actuator of the deposition head to form a desired volume of material at the needle orifice that is deposited on the electronic substrate; and cleaning the needle orifice with air directed to the needle orifice.


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