The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 21, 2015
Filed:
Sep. 06, 2011
Tohru Harada, Kawasaki, JP;
Mitsuo Takeuchi, Kawasaki, JP;
Hirokazu Yamanishi, Kawasaki, JP;
Yoshiaki Yanagida, Kawasaki, JP;
Toru Okada, Kawasaki, JP;
Tohru Harada, Kawasaki, JP;
Mitsuo Takeuchi, Kawasaki, JP;
Hirokazu Yamanishi, Kawasaki, JP;
Yoshiaki Yanagida, Kawasaki, JP;
Toru Okada, Kawasaki, JP;
FUJITSU LIMITED, Kawasaki, JP;
Abstract
An apparatus for mounting an electronic component includes a heating head that moves relative to the electronic component placed on a printed board, inclines according to the inclination of the electronic component, comes into contact with the electronic component, and heats a joining material that joins the printed board and the electronic component; a first sensor that measures the position and the inclination of the heating head; a second sensor that measures the position and the inclination of the printed board; and, a control unit that calculates the position and the inclination of the electronic component based on a measurement result of the first sensor in a state where the heating head is in contact with the electronic component, and determines the melted state of the joining material based on the measurement result of the second sensor and the position and the inclination of the electronic component.