The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 21, 2015

Filed:

Jul. 05, 2013
Applicant:

Nanchang O-film Tech. Co., Ltd., Nanchang, Jiangxi, CN;

Inventor:

Zhao He, Nanchang, CN;

Assignee:

NANCHANG O-FILM TECH. CO., LTD., Nanchang, Jiangxi, CN;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/00 (2006.01); H05K 3/46 (2006.01); G02F 1/1333 (2006.01); G06F 3/041 (2006.01); H05K 1/03 (2006.01); H05K 1/09 (2006.01); H05K 3/00 (2006.01); G02F 1/1343 (2006.01);
U.S. Cl.
CPC ...
H05K 3/465 (2013.01); G02F 1/1333 (2013.01); G06F 3/041 (2013.01); H05K 1/0306 (2013.01); H05K 1/09 (2013.01); H05K 3/00 (2013.01); G02F 1/1343 (2013.01);
Abstract

A conductive glass substrate includes a glass substrate, a silicon dioxide layer, and a conductive mesh line, the glass substrate defines a meshed groove on a surface thereof; the silicon dioxide layer is attached to the surface of the glass substrate having the groove; the conductive mesh line have a shape adapted to that of the groove, the conductive mesh line is deposited in the groove and attached to the glass substrate via the silicon dioxide layer. In the conductive glass substrate, the conductive mesh line is received in the groove, compared with the conventional conductive glass substrate, a flexible substrate as a supporting body is not needed, the cost is down, and the structure of the conductive glass substrate is simple, further reducing the process, saving manpower and resources. A method of preparing the conductive glass substrate is provided.


Find Patent Forward Citations

Loading…