The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 21, 2015

Filed:

Jul. 06, 2012
Applicants:

Aaron R. Cox, Tucson, AZ (US);

William J. Grady, Iv, Cary, NC (US);

Vinod Kamath, Raleigh, NC (US);

Jason A. Matteson, Raleigh, NC (US);

Jason E. Minyard, Phoenix, AZ (US);

Inventors:

Aaron R. Cox, Tucson, AZ (US);

William J. Grady, IV, Cary, NC (US);

Vinod Kamath, Raleigh, NC (US);

Jason A. Matteson, Raleigh, NC (US);

Jason E. Minyard, Phoenix, AZ (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); G06F 1/20 (2006.01); F28D 15/04 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20454 (2013.01); F28D 15/04 (2013.01); G06F 1/20 (2013.01); H05K 7/20336 (2013.01); H05K 7/20218 (2013.01); Y10T 29/49826 (2015.01);
Abstract

An apparatus and method is provided for conveying heat away from an electronic component. In one embodiment, a method positions a conformable thermal interface element in heat conducting contact with an electronic component. A heat conducting member is disposed within the conformable thermal interface element. The heat conducting member is coupled with a manifold so that the heat conducting member is in heat conducting contact with the manifold. The electronic component may be installed or removed without disassembly of the apparatus.


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