The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 21, 2015

Filed:

Jan. 30, 2013
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon, KR;

Inventors:

Young Ki Lee, Suwon, KR;

Kwang Soo Kim, Suwon, KR;

Bum Seok Suh, Suwon, KR;

Chang Seob Hong, Suwon, KR;

Joon Seok Chae, Suwon, KR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); B23P 15/26 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20 (2013.01); B23P 15/26 (2013.01); H05K 1/0201 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/73265 (2013.01); Y10T 29/4935 (2015.01);
Abstract

Disclosed herein is a heat radiating substrate including: a heat radiating plate including a plurality of holes having a predetermined depth and formed in a lower portion of one side thereof; a conductor pattern layer formed on the heat radiating plate and including a mounting pad on which a control device and a power device are mounted and a circuit pattern; and an insulating layer formed between the heat radiating plate and the conductor pattern layer.


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