The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 21, 2015
Filed:
Apr. 27, 2010
Applicant:
Mamoru Sawai, Makinohara, JP;
Inventor:
Mamoru Sawai, Makinohara, JP;
Assignee:
YAZAKI CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01K 3/10 (2006.01); H05K 1/02 (2006.01); H05K 3/40 (2006.01); H05K 3/44 (2006.01); H05K 1/05 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0213 (2013.01); H05K 3/40 (2013.01); H05K 3/4092 (2013.01); H05K 3/44 (2013.01); H05K 1/056 (2013.01); H05K 2201/09754 (2013.01); H05K 2201/10924 (2013.01); Y10T 29/49158 (2015.01); Y10T 29/49165 (2015.01);
Abstract
A wiring substrate includes a wiring board having a main face and a side face substantially perpendicular to the main face; a circuit pattern which is formed on the main face of the wiring board; a soaking plate which is disposed in an intermediate layer of the wiring board; and a plurality of protruding terminals are disposed in the intermediate layer and are projected outwardly from the side face. The protruding terminals are electrically connected in the intermediate layer to each other.