The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 21, 2015

Filed:

Jan. 29, 2014
Applicant:

Hc Semitek Corporation, Wuhan, CN;

Inventors:

Jin Xu, Wuhan, CN;

Jiangbo Wang, Wuhan, CN;

Rong Liu, Wuhan, CN;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 33/00 (2010.01); H01L 33/20 (2010.01); H01L 33/60 (2010.01); H01L 33/46 (2010.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
H01L 33/0075 (2013.01); H01L 33/007 (2013.01); H01L 33/0079 (2013.01); H01L 33/20 (2013.01); H01L 33/60 (2013.01); H01L 21/0242 (2013.01); H01L 21/0254 (2013.01); H01L 21/02639 (2013.01); H01L 21/02647 (2013.01); H01L 33/46 (2013.01); H01L 2924/12041 (2013.01); H01L 2933/0091 (2013.01);
Abstract

A method for preparing a light-emitting diode having a vertical structure by stripping a GaN base epitaxial layer and a sapphire substrate by a wet process, the method including: a) preparing a graphical growth substrate; b) growing a GaN base light-emitting diode epitaxial layer on the graphical growth substrate, the GaN base light-emitting diode epitaxial layer from the bottom to the top successively including a N-type GaN layer and a P-type GaN layer; c) successively forming a transparent and electrically conductive film, an omni-directional reflection layer, an electrically conductive reflection layer, and a passive metal protection layer from the bottom to the top on the GaN base light-emitting diode epitaxial layer; and d) removing the first layer of stable material with a high melting point of the growth substrate by dry etching, exposing the N-type GaN layer, and preparing an N electrode on the N-type GaN layer.


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