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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9087924 B1

PDFFull Text
Date of Patent:
Jul. 21, 2015

Filed:

Apr. 09, 2014

Semiconductor device with resin mold

Applicant:

Denso Corporation, Kariya, Aichi-pref., JP;

Inventors:

Tetsuto Yamagishi, Nukata-gun, JP;

Tohru Nomura, Kariya, JP;

Norihisa Imaizumi, Toyokawa, JP;

Yasutomi Asai, Okazaki, JP;

Assignee:

DENSO CORPORATION, Kariya, JP;

Attorney:

Posz Law Group, PLC

Primary Examiner:

Alexander Oscar Williams

Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/367 (2006.01); H01L 23/433 (2006.01); H01L 23/495 (2006.01); H01L 25/16 (2006.01); H01L 21/48 (2006.01); H01L 23/13 (2006.01); H01L 23/15 (2006.01); H01L 23/498 (2006.01); H01L 23/50 (2006.01);
U.S. Cl.
CPC ...
H01L 24/83 (2013.01); H01L 23/315 (2013.01); H01L 23/3677 (2013.01); H01L 23/4334 (2013.01); H01L 23/49506 (2013.01); H01L 23/49531 (2013.01); H01L 23/562 (2013.01); H01L 25/16 (2013.01); H01L 21/4807 (2013.01); H01L 23/13 (2013.01); H01L 23/15 (2013.01); H01L 23/49822 (2013.01); H01L 23/50 (2013.01); H01L 24/48 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/01019 (2013.01); H01L 2924/01046 (2013.01); H01L 2924/01068 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/1461 (2013.01); H01L 2924/15747 (2013.01); H01L 2924/1815 (2013.01); H01L 2924/19015 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/19107 (2013.01);
Abstract

An electronic device includes: a substrate having first and second surfaces, wherein the first surface is opposite to the second surface; a first electronic element mounted on the first surface of the substrate; a second electronic element mounted on the second surface of the substrate; and a resin mold sealing the first electronic element and the first surface of the substrate. The resin mold further seals the second electronic element on the second surface of the substrate. The second surface of the substrate has a portion, which is exposed from the resin mold. The second electronic element is not disposed on the portion of the second surface.

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