The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 21, 2015

Filed:

Sep. 26, 2012
Applicant:

Fujitsu Semiconductor Limited, Yokohama-shi, Kanagawa, JP;

Inventor:

Eiji Yoshida, Yokohama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/78 (2006.01); H01L 29/06 (2006.01); H01L 21/762 (2006.01); H01L 21/74 (2006.01); H01L 21/308 (2006.01); H01L 29/66 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7833 (2013.01); H01L 21/76229 (2013.01); H01L 21/76232 (2013.01); H01L 29/0638 (2013.01); H01L 21/3081 (2013.01); H01L 21/743 (2013.01); H01L 29/665 (2013.01);
Abstract

A semiconductor device includes a first device isolation insulating film defining a first region, a first conductive layer of a first conductivity type formed in the first region, a semiconductor layer formed above the semiconductor substrate and including a second conductive layer of the first conductivity type connected to the first conductive layer and a third conductive layer of the first conductivity type connected to the first conductive layer, a second device isolation insulating film formed in the semiconductor layer and isolating the second conductive layer and the third conductive layer from each other, a gate insulating film formed above the second conductive layer, and a gate electrode formed above the gate insulating film and electrically connected to the first conductive layer via the third conductive layer.


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