The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 21, 2015
Filed:
Mar. 06, 2013
Applicant:
Seiko Epson Corporation, Tokyo, JP;
Inventor:
Nobuaki Hashimoto, Suwa, JP;
Assignee:
Seiko Epson Corporation, , JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/02 (2006.01); H05K 7/06 (2006.01); H05K 7/08 (2006.01); H05K 7/10 (2006.01); H01L 23/48 (2006.01); H01L 25/16 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/481 (2013.01); H01L 25/16 (2013.01); H01L 23/49827 (2013.01); H01L 2224/16 (2013.01); H01L 2924/3011 (2013.01); Y10T 29/49155 (2015.01); Y10T 29/49165 (2015.01);
Abstract
An electronic substrate includes: an electronic element provided on a first face of a semiconductor substrate having a through hole; a passive element provided on a second face of the semiconductor substrate; a first part of an interconnection pattern provided on the second face of the semiconductor substrate; an insulating layer provided on the second face of the semiconductor substrate; and a second part of the interconnection pattern provided on the insulating layer.