The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 21, 2015
Filed:
Feb. 26, 2014
Renesas Electronics Corporation, Kawasaki-shi, Kanagawa, JP;
Soshi Kuroda, Kanagawa, JP;
Kenya Hironaga, Kanagawa, JP;
Hironori Matsushima, Kanagawa, JP;
Masatoshi Yasunaga, Kanagawa, JP;
Akira Yamazaki, Kanagawa, JP;
Renesas Electronics Corporation, Kawasaki-shi, JP;
Abstract
To achieve a reduction in cost of a semiconductor device, in a common board (a wiring board), a plurality of bonding leads each extend toward the center of the board, and a solder resist film as a die bonding region supporting a minimum chip is coated with a die bonding material. With this, even when a first semiconductor chip as a large chip is mounted, wire bonding can be performed without causing the die bonding material to cover the bonding leads. Thus, development cost can be reduced to reduce the cost of the semiconductor device (LGA).